Equipped with 11th generation Core i/Celeron CPU, 3 2.5GbE, 4 USB3.2, extended operating temperature -20 to 60℃.
【IEI DRPC-W-TGL Features】 ■ Width 176 × Height 67.8 × Depth 116 mm, 1.38 liters ■ Fanless operation with Tiger Lake 11th generation Core i7/i5/i3/Celeron CPU ■ 3 x 2.5GbE, 4 x USB3.2, 2 x HDMI, 1 x DP ■ 1 x 2.5" SATA HDD, 1 x M.2 ■ Extended operating temperature -20 to 60℃ (with SSD) ■ DIN-rail mountable
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basic information
Specifications ■CPU 11th Generation Core i7/i5/i3/Celeron CPU ■Chipset SoC ■Memory DDR4-3200 SODIMM x 1 (8GB installed, maximum 32GB) ■Storage 2.5" SATA HDD x 1, M.2 2230 A-Key (PCIe/USB 2.0) x 1 ■Expansion Slot M.2 3042/3052 B-key (PCIe Gen3 x2) x 1 ■I/O Connectors 2.5GbE x 3 (2 I225V, 1 I225V (I225-LM (i5/i7 SKU)))(RJ-45), USB3.2 x 4, HDMI x 2, DP x 1 ■Input Power 12 VDC input ■Weight 0.98kg ■Operating Temperature -20 to 60℃ (extended temperature when using SSD) with airflow ■Shock Half sine wave vibration 5G; 11ms; 100 axes ■Vibration 10-500Hz, 1.04Grms, random, 1 hr/axis (when using SSD) ■Certification CE, FCC, UKCA ■OS Win10/11, Linux
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Delivery Time
Applications/Examples of results
Factory and Building Automation / Multimedia Systems / Digital Signage
Line up（6）
| Model number | overview |
|---|---|
| DRPC-W-TGL-U-CC-R10 | Celeron 6305 1.8GHz, 8GB DDR4 |
| DRPC-W-TGL-U-CEC-R10 | Celeron 6305E 1.8GHz, 8GB DDR4 |
| DRPC-W-TGL-U-i3C-R10 | Core i3-1115G4E 2.2GHz, 8GB DDR4 |
| DRPC-W-TGL-U-I5C-R10 | Core i5-1145G7E 1.5GHz, 8GB DDR4 |
| DRPC-W-TGL-U-i7C-R10 | Core i7-1185G7E 1.8GHz, 8GB DDR4 |
| Options | 60W AC adapter, expansion fan, COM cable, GPIO cable |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.
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