[Analysis Case] chtMultiRegionFoam Solver

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last updated：Jun 28, 2023

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Significant cost reduction in numerical simulations with OpenFOAM! Introducing a case study of thermal fluid analysis for enclosures.

This is an introduction to a case study conducted using the chtMultiRegionFoam solver for thermal fluid analysis of a casing, including heat conduction within solids. Eight solid materials were defined, with one inlet and one outlet set up, and a porous body defined at the inlet. Four cases were calculated: in cases 1-1 to 1-3, a velocity was defined at the outlet to check the airflow resistance (system impedance), and in case 2, a fan model was set up based on P-Q characteristics for the calculation. [Case Overview] ■ By executing multiple patterns of calculations with a specified flow rate at the outlet, it is possible to investigate airflow resistance (system impedance). ■ By defining P-Q characteristics at the outlet, thermal fluid analysis can be performed at the operating point of the fan. *For more details, please refer to the related links or feel free to contact us.