We have various types ranging from inline machines to standalone types equipped with cassette loaders and unloaders.
Each substrate is transferred to the crimping section by each robot, where auto-alignment is performed and crimping is carried out. After crimping, alignment is performed again, and the UV material is cured by UV irradiation, temporarily fixed, and then discharged downstream. It supports various types of substrates, such as wafers, and has a variety of types ranging from inline machines to standalone types equipped with cassette loaders and unloaders.
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basic information
The basic device is an inline system that performs high-precision alignment of the input upper and lower substrates, bonds them together, and discharges them.
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We solve your problems with bonding and sealing! - We propose a new bonding process that combines vacuum and atmosphere - Bonding of various shapes is possible. Prototyping and demo support are available, so please consult with us. At Joyo Engineering, as a top manufacturer of LCD bonding equipment and LCD cell gap formation equipment, we have produced many specialized devices that cater to various materials and process conditions, responding to our customers' needs. Based on numerous achievements, we have now released a new "vacuum bonding device." This device solves issues such as "air bubble inclusion in decorative panels with steps or slits," "design constraints of 2.5D/3D shapes," and "processing unevenness and positional deviation of thin substrates like films," enabling bonding of various shapes.