Bubble-free bonding device (OCR type)
In a panel assembly device for smartphones and tablet PCs, cover glass, switch boards, 3D boards, etc., are bonded to the LCD substrate in a vacuum.
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basic information
The method varies depending on the type of panel, the supply method of the substrate, and the production form.
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Applications/Examples of results
Assembly device for bonding panels in a vacuum.
Company information
Shinko Engineering Co., Ltd. has continuously created unique products in the design and manufacturing field of information and communication technology-related devices and systems since its establishment. In particular, we have consistently demonstrated originality in motor drive technology for mechatronic equipment and conveyor systems, image processing technology for inspection and measurement devices, and application products of laser technology, as well as integrating these standalone devices into CIM as FA systems. Our mission is to fully utilize the technological capabilities we have accumulated so far and to deliver products and devices that will delight our customers more than ever before. In the future, we aim to be a one-of-a-kind company that consistently demonstrates originality in the ever-advancing field of information and communication technology.
