An ultra-soft thermal conductive sheet that achieves excellent thermal conductivity. It fills the gaps of fine unevenness and efficiently conducts heat.
It is used by placing it between the heat-generating components (such as CPU and GPU) and the heat-dissipating components (such as heat sinks). It is the optimal size for a computer's CPU. 【Features】 ● It efficiently conducts heat, demonstrating high heat dissipation performance. ● It has excellent insulation properties and is a flexible thermal conductive material. ● Being a soft material, it adheres closely to uneven surfaces, preventing the formation of air layers. ● Unlike thermal grease, it is a matter of sticking rather than applying, making the process easier. ● It can be easily cut with scissors or a cutter, allowing for precise size adjustments. ● RoHS compliant. *Please handle this product with care as it is made of a soft material. For installation, remove one side of the protective sheet and attach the exposed side to the substrate. After sticking it on, remove the protective sheet from the other side. This method allows for relatively smooth application.
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basic information
Model number: WW-TGA4500 Dimensions: 30mm × 30mm × thickness 0.5mm Thermal conductivity: 4.5W/m·K Flame retardancy: V-0 UL-94 Dielectric strength: ≧10 kV/mm Operating temperature range: -50℃ to 180℃ Volume resistivity: 1×10^13 Ω·m Hardness: 50 shore 00 Double-sided adhesive
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Applications/Examples of results
● Thermal measures for heat-generating components in electronic and electrical devices. ● Heat dissipation measures for CPUs and ICs. ● Thermal measures for power ICs and power supply. ● Heat dissipation measures for all heat-generating bodies.
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Nidec Corporation Authorized Dealer Taiwan CHIA CHERNE General Agent Taiwan SUNON Sales Agent Taiwan PRO-ARIES INDUSTRIES General Agent Tranyoung Technology Sales Agent Taiwan Thermal Transtech International General Agent