Introducing examples of smooth removal made possible by using our independently developed tools!
We would like to introduce a case study of underground obstacle removal conducted by our company. In Nihonbashi, Chuo-ku, Tokyo, where the Shinkansen runs nearby, we used the SR45 multi-drill to remove a site construction pile with a diameter of Φ1200 and a depth of GL-22m. The removal of the site construction pile in a narrow area was extremely challenging, but by utilizing our uniquely developed Kelly grab, 3D bucket, and lightweight power jack, we were able to achieve a smooth removal. 【Case Overview】 ■ Project Name: SR45 Multi-Drill Method - Underground Obstacle Removal ■ Construction Date: September 11, 2021 ■ Location: Hon-Ishicho, Nihonbashi, Chuo-ku, Tokyo ■ Details: Φ1200 GL-22m *For more details, please download the PDF from the related link or contact us.
Inquire About This Product
basic information
For more details, please download the PDF from the related link or contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please download the PDF from the related link or contact us.
Company information
Our company conducts construction work related to building foundations, including the removal of underground obstacles using the multi-drill method, ground improvement work for single-family residential lots, pile driving for low to mid-rise apartment buildings, retaining wall support pile installation, excavation work, and ground surveys. We have a system in place to propose appropriate methods based on usage and construction conditions, providing comprehensive support from design to municipal responses, as well as construction and management. We have developed numerous original methods and obtained patents, NETIS registrations, and utility model certificates. Please feel free to consult us even for projects that have been declined by other companies. In collaboration with our group company, Tomi Crane Co., Ltd., we respond with a wealth of machinery, years of experience and trust, and high-level technology.