LGA1700 12th generation Core i9/i7/i5/i3, Q670E/H610E, Q670, 2x DDR5 maximum 64GB
【7Starlake INS8367B Features】 ■ Mini-ITX form factor ■ Supports 12th generation Intel Core i9/i7/i5/i3 CPUs ■ 2x DDR5 up to 64GB ■ Supports dual independent displays via 1 x HDMI, 1 x DP, 1 x LVDS ■ 1 x M.2 M-Key 2242/2280, 1 x M.2 E-Key 2230, 1 x M.2 B-Key 3042, 1 x PCIe 3.0 x4 ■ 6 x USB3.1, 5 x USB2.0 ■ Supports 2 x SATAIII, 1 x 2.5GbE + 1 x GbE LAN
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basic information
Specifications ■CPU: 12th Generation Intel Core i9/i7/i5/i3 Processor ■Chipset: Intel Q670 Chipset ■Memory: 2x DDR5 Maximum 64GB ■Display Ports: 1 x HDMI, 1 x DP, 1 x LVDS ■I/O Interfaces: 6 x USB3.1; 5 x USB2.0, 2 x SATAIII, 1 x 2.5GbE + 1 x GbE LAN, 1 x MIC-IN; 1 x LINE-OUT ■Expansion Slots: 1 x M.2 2230 E-Key (PCIe 3.0 X1, USB2.0), 1 x M.2 2242/2280 (PCIe 3.0 X4, SATAIII), 1 x M.2 3042 B-Key (USB2.0, PCIe 3.0 X1, SATAIII), 1 x PCIe 3.0 X4 slot ■Dimensions: 170W x 170D (mm) ■Operating Temperature: -40 to 85℃
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Delivery Time
※The delivery time may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
Factory and Building Automation / Multimedia Systems
Line up（2）
| Model number | overview |
|---|---|
| INS8367B-01ET | Intel 12th Gen. Alder Lake-S Core i9/i7/i5/i3, DDR5 up to 64GB,M.2 expansion slots: M.2 M-Key 2242/2280, M.2 E-key 2230, M.2 B-Key 3042, 1 x PCIex4 Slot, 6 x USB3.1, 5 x USB2.0, DC-IN 12V, -20 to 70°C |
| INS8367B-01UT | Intel 12th Gen. Alder Lake-S Core i9/i7/i5/i3, DDR5 up to 64GB, M.2 expansion slots: M.2 M-Key 2242/2280, M.2 E-key 2230, M.2 B-Key 3042, 1 x PCIex4 Slot, 6 x USB3.1, 5 x USB2.0, DC-IN 12V, -40 to 85° |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.
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