High thermal conductivity and low thermal expansion coefficient, as well as being soft and gentle on mixing and molding equipment, oxide heat dissipation filler!
In recent years, the demand for thermal management in the field of electronic components has increased, and metal oxides such as alumina, magnesia, and zinc oxide, as well as nitrides like aluminum nitride, are widely used as thermal conductive fillers. Among these, zinc oxide has attracted attention due to its excellent thermal properties and its relatively low Mohs hardness compared to alumina, making it softer. Our company offers multiple grades with different particle sizes in two categories: conventional particles and spherical particles. Based on our long-established technology for controlling particle shape and surface treatment of inorganic compounds, we provide solutions for thermal management, including the highest density packing.
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basic information
〇General shape particles (LPZINC Series): Particle diameter approximately 2μm to 20μm 〇Spherical particles (LPZINC-S Series): Particle diameter approximately 6μm to 70μm We also accept various surface treatments. Please contact us for more details.
Price range
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Applications/Examples of results
【Applications】 - Heat dissipation sheets and other resin molded products - Additive for heat dissipation grease
Line up（2）
| Model number | overview |
|---|---|
| LPZINC Series | Four types are available in the lineup: LPZINC-2, 5, 11, and 20, based on particle diameter |
| LPZINC-S Series | With spherical particles, five types are available in the lineup: LPZINC-6S, 10S, 20S, 30S, and 50S, based on particle diameter |
catalog（1）
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Company information
Since our founding in 1917, we have created various high-performance products using our unique special technologies cultivated over many years, supporting your daily life and industries. Moving forward, we will continue to leverage our core technologies such as ultrafine particle size reduction, ultra-high purity, particle shape control, and surface treatment technology to advance research and development and deliver innovative and high-quality products.
