Prepare a uniform and flat wafer surface as a precondition for depositing additional layers!
We would like to introduce our company's circuit formation in semiconductors, specifically "CMP (Chemical Mechanical Planarization)." Chemical Mechanical Planarization is the preparation for depositing additional layers that will form the circuits of final microprocessors, memory chips, LEDs, and other products. It creates a uniformly flat wafer surface. 【Features】 ■ Creates a uniformly flat wafer surface ■ Preparation for depositing additional layers that will form the circuits of products *For more details, please refer to the related links or feel free to contact us.
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Since our establishment in 1945, we have maintained the philosophy of providing our customers with the best products as a dedicated manufacturer of rotary joints. In recent years, we have also created unique products based on our original design concepts in slip rings, which facilitate the exchange of electrical signals, data, and power in rotating bodies. To realize our customers' visions, we will propose strong solutions through our skilled engineering team and modern manufacturing facilities. We will provide the best products that truly satisfy our users. We have launched a Japanese website. https://www.deublin.com/ja-JP/