For selective soldering equipment! Detecting ground connection pins that require preheating time.
"Freedom" is a program creation system that generates soldering programs based on CAD data standards, automatically optimizing preheating/spray time and soldering paths. It automatically selects nozzle diameter and operation from the board layout information. It can automatically check for interference based on the clearance between the nozzle and surrounding components. 【Features】 ■ Soldering path optimization ■ Profile creation ■ Component interference check ■ Component library function *For more details, please refer to the PDF document or feel free to contact us.
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【Other Features】 ■ Detects and displays areas of component interference check errors ■ 3D soldering simulation to check for component interference and soldering routes ■ Automatically calculates suitable routes and also computes tact time *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
