Production management (traceability) supports quality control! Introducing our soldering equipment.
The EQSS-350SD is a space-saving inline model point soldering device. By adding an expansion unit to the "solder pot module," production efficiency is improved. The adoption of a two-dimensional code enhances the automatic changeover system and mixed production capabilities, improving production operating rates. 【Features】 ■ By setting the maximum substrate size of 350mm horizontally, the length of the spray and preheating dip device is reduced to 1600mm (excluding the feeder conveyor) for space-saving. ■ The addition of an expansion unit to the "solder pot module" improves production efficiency. ■ The use of a two-dimensional code enhances the automatic changeover system and mixed production capabilities, improving production operating rates. ■ Production management (traceability) supports quality control. *For more details, please refer to the PDF materials or feel free to contact us.
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basic information
【Standard Specifications】 ■ Spray nozzle: 2-fluid ■ 3-light signal tower ■ Application, instruction manual, standard tools ■ Gullwing door interlock ■ Touch panel operation ■ Calibration glass: 1 piece *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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In the 1980s, surface mount components that responded to the miniaturization of electronic products emerged, and we designed and sold "adhesive curing devices" to coincide with the sale of adhesives for temporarily fixing chip components. We also established a double wave flow soldering method and designed and sold "flow soldering devices compatible with mixed chip components," using Koki flux, which maintains high soldering quality. In the 1990s, with the spread of the concept of environmental conservation, there was a demand for mounting technologies in the manufacturing processes of electronic products that do not adversely affect the environment. To respond to this background, we engaged in the development of solder flow methods applicable to no-clean flux for electronic substrates and the design and sale of "alternative fluorocarbon cleaning devices" compatible with non-fluorocarbon cleaning. In recent years, to meet the demand for "lead-free soldering methods" since 1998, we have been striving to develop technologies for lead-free "flow soldering devices," "reflow devices," and "partial/local dip devices" that can ensure soldering quality on par with conventional "tin/lead solder mounting."
