[Example] High-density wire bonding with a chip pitch of 0.2mm

Keep the length of the wire itself to 0.4mm or less! An example that contributed to the improvement of communication speed.

We would like to introduce a case of high-density wire bonding with a chip-to-chip distance of 0.2mm. In order to increase the communication speed of optical communication modules (PD-TIA) as much as possible, we received an inquiry about whether it was possible to reduce the distance between the optical devices and the transceiver ICs, thereby bringing the chip-to-chip distance even closer. Thanks to the precise implementation by our skilled in-house technicians, we were able to reduce the distance between the chips from 0.5mm to 0.2mm, successfully achieving a faster communication module. [Case Overview (Partial)] ■ Implementation Method - Wire Bonding = Wire Bonder - Resin Coating = Manual Dispenser ■ Board Size: 121mm x 177mm x 1mm (6-layer board) ■ Board Material: MEGTRON6 (Glass Cloth) *For more details, please refer to the PDF document or feel free to contact us.

Circuit board design and manufacturing