Minimum L/S, manufacturable layer count, board thickness, etc.! Introducing our printed circuit board specifications.
We would like to introduce the "Printed Circuit Board Specifications" handled by Screen Process Co., Ltd. The maximum IVH interlayer thickness can accommodate up to 0.4t and the minimum hole diameter is φ0.1mm. We also support sequential IVH. For more details, please refer to the catalog. 【Minimum L/S】 ■ Outer layer 18μm: 100/100μm ■ Outer layer 35μm: 150/150μm ■ Outer layer 70μm: 250/250μm ■ Outer layer 12μm: 80/80μm (pads and vias cannot be mixed) ■ Inner layer 35μm: 80/80μm ■ Inner layer 70μm: 200/200μm *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Possible Number of Layers and Board Thickness】 ■ Number of Layers: Single-sided board, double-sided board, multilayer board (3 to 30 layers) ■ Board Thickness: 0.1t to 4.8t *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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The screen process strives to meet various customer needs by pursuing high quality, high precision, and short delivery times, while also accurately responding to the demand for lower prices. Furthermore, we aim to deliver products that anticipate future directions and contribute to a prosperous future.