DFI, equipped with 9th/8th generation CPU, AI Accelerated computing, for embedded systems, compact and fanless operation.
Features ■ Width 340.5 × Height 132 × Depth 223 mm ■ Weight (kg) 9.85 kg ■ Equipped with Coffee Lake 9th/8th generation CPU ■ Dual Channel DDR4 2666/2400 MHz (up to 64GB) ■ AI Accelerated computing ■ Supports up to 150W GPU MXM module ■ Supports 4 x 802.3af 15W PoE ports, up to 15.4W ■ Supports maximum resolution of 4K with 3 independent display outputs (1 x VGA, 1 x HDMI, 1 x DP++) ■ 1 x Half-size Mini PCIe, 2 x Full-size Mini PCIe, 1 x M.2 B key 3042, 3052, 1 x M.2 2280 M key 2242, 2260 & 2280 expansion slots ■ 2 x RJ45 GbE, 2 x High speed full RS-232/422/485 (DB-9), 2 x RS-232/422/485 (onboard), 2 x USB 2.0 supported
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Specifications ■CPU: Intel Core i7-9700TE/i7-8700T/i7-9700E/i5-9500TE Processor ■Chipset: Intel Q370 Chipset ■Memory: Dual Channel DDR4 2666/2400 MHz (up to 64GB) ■Storage: 4 x 2.5 inch SSD storage bays (hot-swappable), 1 x M.2 2280 M key (supports SATA SSD) ■I/O Connectors: 2 x RJ45 GbE, 4 x 802.3af 15W PoE ports, 2 x High speed full RS-232/422/485 (DB-9), 2 x RS-232/422/485 (onboard), 2 x USB 2.0 ■Input Power: DC input 12V ■Mounting Method: Wall Mount ■Operating Temperature: -25°C to 70°C (CPU+GPU<100W), -25°C to 55°C (CPU+GPU<160W) ■Certifications: CE, FCC Class A, UKCA, RoHS
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Delivery Time
※The quantity and timing may vary, so please feel free to contact us.
Applications/Examples of results
For machine, factory, and building automation/monitoring systems.
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Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.