Efficient collective packaging! We meet the stringent needs of the electronic components field.
We would like to introduce an example of "buffer materials for semiconductor devices" that we handle. We use Santech Foam "Grade A," which has high static electricity prevention performance. It reduces dust adhesion and prevents electrostatic destruction of devices. We also introduce examples of "packaging boxes for hard disks" and "shipping boxes for optical components." 【Example Overview】 <Features of Buffer Materials for Semiconductor Devices> ■ Reduces dust adhesion and prevents electrostatic destruction of devices. *For more details, please refer to the related links or feel free to contact us.
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Since our founding in 1958, we at OIZURU have consistently pursued and provided advanced and high-quality cushioning packaging design technology, thoroughly addressing the packaging and logistics issues faced by our customers. Focusing on the packaging of Japan's representative high-tech precision products, such as information communication and measurement and analysis equipment, as well as cold storage boxes for frozen and refrigerated foods, every cushioning and packaging material developed by OIZURU is unique. Since each customer's needs are different, we repeatedly create prototypes to accurately respond to those needs. Our stance on manufacturing at OIZURU is to create the optimal products that protect important items.