We specialize in prototype manufacturing and small-scale production of printed circuit boards, primarily focusing on single-sided, double-sided, four-layer, and six-layer boards. In addition to FR-4 material, we can also accommodate aluminum and iron materials.
Manufacturing of high-layer-count multilayer substrates, IVH substrates, build-up substrates, and back-drill substrates with eight or more layers is possible in collaboration with partner companies. We can also accommodate substrate manufacturing using "low dielectric materials" MEGTRON 6 and MEGTRON 7, as well as "FR-4" halogen-free materials. In addition to printed circuit board manufacturing, we also perform the following tasks: - We collaborate with partner companies that have first and second-class qualifications in printed wiring board manufacturing to conduct artwork design and simulation analysis. - We also handle component mounting for prototype projects.
Inquire About This Product
basic information
Design Achievements (Maximum Size) - Maximum Dimensions: 500X420mm - Maximum Layers: 28 layers T3.7 - Maximum Number of Component Pins: 48,000 pins - IVH, build-up boards, back drilling (aspect ratio 8 to 10) - High-density 0.5mm pitch BGA (0.4mm pitch BGA also possible) - 1,932 pin BGA
Price information
For more details, please contact our representative (Tanaka).
Delivery Time
Applications/Examples of results
- Broadcasting and Video Equipment: Surveillance cameras, video/image transmission devices, master switchers, terrestrial digital transmitters, etc. - Communication Equipment: High-capacity network devices, base station transceivers, ADSL, routers, modems, etc. - Medical Equipment: Endoscopes, ultrasound devices, etc. - Audio Equipment: Level meters, etc. - Semiconductor Devices: LSI evaluation boards, semiconductor testing equipment, etc. - Computers: Motherboards, printer control devices, etc. - Gaming Equipment: Pachinko, pachislot, etc. - Backplanes: For VME, CPCI bus, etc.
News about this product（1）
Company information
Our company is a comprehensive processing manufacturer capable of handling metal etching products, electroforming products, and machining. In addition to etching, we can perform wire processing, laser processing, and NC processing, allowing us to also handle the processing of brittle materials such as resins, ceramics, quartz, glass, and carbon. Please feel free to contact us with your requests. Additionally, we have started a new business in contract design and manufacturing of printed circuit boards, which is already being utilized by various customers. For more details, please contact us.
![[Introduction to the Fair Process] Manufacturing/Assembly/Inspection/Packaging](https://image.mono.ipros.com/public/product/image/594/2000822078/IPROS49743046305756960544.png?w=280&h=280)
