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We have introduced a sintering device from Boschman (Netherlands) to the Shinwa Mechatronics System Center (Kasugai City, Aichi Prefecture). Please utilize our equipment for various development scenarios. - Sintering material development evaluation - Prototype of power devices - Other process considerations 【Recommended for the following individuals!】 ◎ Those advancing the next generation and high reliability of power modules (SiC/IGBT) - Considering or promoting the transition from Si to SiC - Facing high current density and high heat generation - Wanting to further enhance the lifespan and thermal performance of modules ◎ Those looking to replace soldering processes for die attach and heat sink attach with Ag sintering - Feeling limitations in the thermal fatigue lifespan of solder joints - Needing to accommodate high-temperature operations - Facing stricter customer demands for mounting reliability ◎ Those experiencing challenges with the reproducibility and uniformity of the sintering process - Variability in sintering conditions due to chip position and size - Pressure and temperature inconsistencies leading to voids - Wanting to explore processing conditions For more details, please feel free to contact us. Contact person: Mizuno, Strategic Sales Promotion Office, Shinwa Co., Ltd.
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basic information
【Device Specifications】 - Sintering Area: (Maximum 350×270mm) - Pressing Capacity: 0.5–30Mpa - Heating Capacity: 30℃–285℃ - Sintering Environment: Atmosphere/N2 【Auxiliary Equipment】 - Paste Printer - Die Mounting Machine - SAT - Preheat Cooling Table
Price range
P3
Delivery Time
※[Negotiable] It varies depending on the trial and prototype content. Please contact us.
Applications/Examples of results
- Sintering paste evaluation (silver, copper) - Power module prototype - Die attach prototype - Heat sink attach prototype
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Company information
Our company is a development and proposal-oriented trading firm with "metal joining" as the core of our business, actively involved in manufacturing. We offer contract services and maintenance using joining technologies such as brazing, build-up welding, and thermal spraying, as well as sales of equipment and materials, introduction of industrial machinery, and construction of FA systems. Furthermore, we engage in the development and manufacturing of electronics-related devices, achieving a diverse and flexible business style that spans a wide range of fields. We will continue to demonstrate our uniqueness through the pursuit of manufacturing and are committed to contributing to the development of the industrial sector as our mission, striving for business expansion.
