Tohoku Univ. Technology : Cryogenic cooling without helium gas : T07-149
Can be used for superconducting refrigerant, cell freezing, and semiconductor cleaning
Helium is difficult to obtain and expensive, so cooling systems that use helium are expected to be difficult to continue using. The invention enables rapid cooling without helium by continuously spraying a two-phase flow of cryogenic gaseous N2 and solid N2 (SN2 ). Specifically, it is characterized by continuously generating slush N2 by spraying at transonic speed using a Laval nozzle. In an example of cell freezing, a 23% improvement in cell survival rate during thawing was achieved compared to liquid nitrogen immersion. This invention has the potential for application in various cooling systems beyond this specific example. Additionally, its application for resist removal in semiconductor cleaning without harmful chemicals is also under consideration.
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The revenue generated from technology transfer is reinvested as new research funding for universities and researchers, and is utilized to create further research outcomes. To ensure the smooth operation of this cycle, known as the "Intellectual Creation Cycle," we will vigorously promote technology transfer. The types of seeds we handle include patents, know-how, databases, and programs. We have established a collaborative framework by signing basic technology transfer agreements with the following universities (as of June 1, 2025): Tohoku University, Hirosaki University, Iwate University, Akita University, Fukushima University, Yamagata University, Tohoku Gakuin University, Iwate Medical University, Fukushima Medical University, Aizu University, Miyagi University, Hokkaido University, Muroran Institute of Technology, and Showa Medical University.
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