Generally, high multi-layer lamination technology is adopted in manufacturing.
Number of layers: 4 layers Material: FR4 Board thickness: 2.28 +/- 0.23 mm Surface treatment: Electroless gold plating Copper foil thickness: 1/3/0.85 OZ
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basic information
Increase the wiring possible area and enhance the wiring density. Reduce the thickness of the insulating medium to decrease the overall thickness and weight of the printed circuit board. Shorten the length of wire interconnections to reduce electrical signal interference and loss. The relatively small thickness of the vias improves the reliability of interconnections. The structural design of the vias is convenient, allowing for greater design flexibility and improved design efficiency.
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Delivery Time
※The delivery time may vary depending on the quantity, so please feel free to contact us.
Applications/Examples of results
Laptops and tablet computers, automotive electronics, aerospace, medical devices, wearable electronics, robots, smart devices, etc.
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Company information
Our company, ExPlus, was established in Taiwan in 1997 and is a specialized manufacturer focusing on printed circuit boards.
![[Example of Printed Circuit Board Manufacturing] Build-up Board](https://image.mono.ipros.com/public/product/image/589/2001120579/IPROS45534754416742640010.png?w=280&h=280)
