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  6. Introduction to Semiconductor Packaging Services and COF Assembly Services

Introduction to Semiconductor Packaging Services and COF Assembly Services

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last updated:Dec 27, 2023

エスタカヤ電子工業
エスタカヤ電子工業
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Capable of handling everything from mass production to small-lot prototyping. Provides comprehensive support for product development, material procurement, assembly, and electrical characteristic testing.

Our company offers COF (Chip On Film) assembly services. We have developed our own production equipment using a highly productive reel-to-reel method, and we possess a wide range of integrated equipment. This allows us to leverage the product features of COF (film bendability, fine wiring pitch compatibility, and thin profile support) to meet the diverse needs of our customers, not limited to display applications. 【Service Features】 - Mass production of fine wiring pitch products is possible (mass production record: 22um pitch, prototype record: 18um pitch) - We can accommodate various needs such as mounting multiple ICs, attaching reinforcement plates, component mounting, drilling, singulation, and conducting various reliability tests. - We have a production capacity of 12 million units per month. *Please feel free to contact us.

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0115_s-takaya_550_550_2076428.jpg

Introduction to Semiconductor Packaging Services and COF Assembly Services

0115_s-takaya_550_550_2076428.jpg
0115_s-takaya_550_550_2076428.jpg

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basic information

Basic flow (example) [Wafer: supplied by customer] → WT (CP) → back grinding → dicing → [Film: designed and procured in-house] → inner lead bonding (ILB) → underfill application → laser marking → electrical testing → visual inspection → defective punching and counting → packaging → shipping

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Driver for LCD panel display, driver for printer head

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Semiconductor Packaging Service 'COF (Chip On Film) Mounting Service'

Semiconductor Packaging Service 'COF (Chip On Film) Mounting Service'

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エスタカヤ電子工業

エスタカヤ電子工業

Electronic Components and Semiconductors

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Estakaya Electronics Co., Ltd. has contributed to the development of an information-oriented society through the development and manufacturing of LSI (Large Scale Integration) devices and modules. Currently, we are also engaged in the manufacturing and sales of unique development products utilizing our long-cultivated technology and know-how, as well as the sale and service of environmental products to the local community. In the future, we will further respond to the diverse needs of our customers in an evolving society, from the development of original LSI device and module products to the establishment of production systems, as well as the creation of custom-made equipment and tools.

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