Pre-dry treatment before direct adhesive bonding using an atmospheric pressure plasma device.
Basic concept of molecular bonding adhesion and joining (direct adhesion) using a downstream atmospheric pressure plasma device.
Our company's downstream plasma device eliminates various damages that occur during processing, enabling clean treatment and smooth surface adhesion. It is suitable for applications such as FCCL manufacturing for 5G and 6G, as well as for carbon films in the secondary battery market, and for bonding dissimilar materials during electrode manufacturing and dry pre-treatment. Additionally, by changing the added gas and optimizing plasma parameters, we can selectively impart functional molecules (such as covalent bonding molecules) to the interface, matching the bonding molecules to the material of the joining interface. Even for challenging hydrophilization of PFA and PTFE surfaces, it is possible to reduce the contact angle to below 10 degrees. *Sample work is also conducted at our lab. [Contents] ■ Basic Concept ■ Advantages ■ Processing Image (R to R) *For more details, please refer to the PDF document or feel free to contact us.
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We are expanding a new approach using dry processes to leverage the reliability of our equipment and various know-how cultivated through sales performance, applying its advantages to other markets (such as the battery market and particles) alongside process applications. Our downstream-type high-density plasma source (electrode) processing section is isolated from the workpiece, preventing any electrical or physical damage to the workpiece, and eliminating the effects of ultraviolet light generated during plasma creation. This allows for the only clean processing (particle-free) possible with atmospheric pressure plasma equipment. By changing the added gases, we can selectively impart molecular functionality, enabling interface control according to various surface materials as a processing technology. This is an effective means for direct adhesion, adhesion of dissimilar materials, and enhancing the adhesion of stronger coatings. The processing width (plasma width) can uniformly handle from 100mm to 3000mm. We can also accommodate carbon fiber bundles and fiber bundle shapes, allowing for uniform processing even within the bundles. Additionally, we can handle the same processing for particles. We manufacture tabletop experimental devices of the downstream type, conduct spot-type device experiments (starting from 2.5 million yen), and also carry out on-site experimental sample work.