Tray packaging parts can also be handled by the tray supply device (ATS15)! Introducing our production equipment.
The "YS12/YS12-F" is a surface mount machine compatible with a substrate size of L510×W460. It can accommodate 0402 chips. Tray-packaged components can also be handled with the tray supply device (ATS15). *Applicable only for YS12F. Please feel free to contact us when you need assistance. 【Production Process】 1. SMT Line Configuration 2. Mount Inspection 3. Manual Soldering 4. Assembly and Electrical Inspection *For more details, please refer to the PDF materials or feel free to contact us.
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At VEMS Corporation, we primarily provide EMS (Electronic Manufacturing Services) for industrial electronic devices to meet the outsourcing needs in the electronics industry. We promise our customers to uphold a quality-first principle, aiming for a zero defect rate, and to pursue the possibility of meeting diverse needs such as short delivery times and small lot production through our unique variable production system until our customers are satisfied. Additionally, to adapt to the ever-changing manufacturing landscape, we are committed to acquiring knowledge and skills, striving to become an attractive company that can be of service to our customers.