VEMS Product Lineup

The "ULTIMA-SSP" is a tabletop spray device that supports substrate sizes from 50W×50L to 250W×330L mm. It is equipped with a substrate detection and mistake prevention mechanism. Please feel free to contact us when you need assistance. 【Production Process】 1. SMT Line Configuration 2. Assembly Inspection 3. Manual Soldering 4. Assembly and Electrical Testing *For more details, please refer to the PDF document or feel free to contact us.

• spray

The "ULTIMA-STR2" is a tabletop point soldering device equipped with a laser-type jet wave height detection function. It supports board sizes from 50W×50L to 250W×330L mm. Please feel free to contact us when you need assistance. 【Production Process】 1. SMT Line Configuration 2. Assembly Inspection 3. Manual Soldering 4. Assembly and Electrical Testing *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment

The M22XGDA-350 is a tabletop 3D inspection device that allows for inspection without being affected by height differences, thanks to programmable Z-axis height settings. It supports a maximum component height of 40mm and can inspect both component surfaces and solder surfaces. Please feel free to contact us when you need assistance. 【Features】 ■ Supports a maximum component height of 40mm ■ Capable of inspecting both component surfaces and solder surfaces ■ Allows inspection without being affected by height differences *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

The "YSi-V" is a high-end hybrid optical appearance inspection machine. It features a hybrid method combining high-speed 2D inspection and 3D height inspection. It supports substrate sizes ranging from a maximum of L610×W560 to a minimum of L50×W50. Please feel free to contact us when you need assistance. 【Features】 ■ High-end hybrid optical appearance inspection machine ■ Hybrid method of high-speed 2D inspection and 3D height inspection ■ 3D inspection with no blind spots through height inspection from four directions ■ Supported substrate sizes range from a maximum of L610×W560 to a minimum of L50×W50 *For more details, please refer to the PDF document or feel free to contact us.

• Other inspection equipment and devices

The "Nj0611M82-RLF" is an N2 reflow device compatible with a substrate size of L500×W400. It features 8 heating zones and 2 cooling zones. Please feel free to contact us when you need assistance. 【Production Process】 1. SMT Line Configuration 2. Assembly Inspection 3. Manual Soldering 4. Assembly and Electrical Testing *For more details, please refer to the PDF document or feel free to contact us.

• Reflow Equipment

The "YSM20" is a surface mount machine equipped with a high-efficiency modular system. It offers high-quality mounting with a repeatability accuracy (3σ) of ±0.025mm. It supports board sizes ranging from a maximum of L810×W490 to a minimum of L50×W50. Please feel free to contact us when you need assistance. 【Features】 ■ High-efficiency modular surface mount machine ■ High-quality mounting with a repeatability accuracy (3σ) of ±0.025mm ■ High-speed mounting performance with a mounting rate of 90,000 CPH ■ Supports board sizes from a maximum of L810×W490 to a minimum of L50×W50 *For more details, please refer to the PDF document or feel free to contact us.

• Other mounting machines

The "YS12/YS12-F" is a surface mount machine compatible with a substrate size of L510×W460. It can accommodate 0402 chips. Tray-packaged components can also be handled with the tray supply device (ATS15). *Applicable only for YS12F. Please feel free to contact us when you need assistance. 【Production Process】 1. SMT Line Configuration 2. Mount Inspection 3. Manual Soldering 4. Assembly and Electrical Inspection *For more details, please refer to the PDF materials or feel free to contact us.

• Other mounting machines

The "VP6000M-V" is a cream solder inspection machine that supports fine pad inspection with high measurement accuracy and repeatability. Inspection speed is compatible with 8,000 mm²/sec (standard). Please feel free to contact us when you need assistance. 【Production Process】 1. SMT Line Configuration 2. Mounting Inspection 3. Manual Soldering 4. Assembly and Electrical Inspection *For more details, please refer to the PDF materials or feel free to contact us.

• Other inspection equipment and devices

The "YCP10" is a high-performance compact printing machine. It achieves high-quality printing with a repeat positioning accuracy of (6σ) ±0.010mm. It supports substrates ranging from a maximum size of L510×W460(mm) to a minimum size of L50×W50. Please feel free to contact us when you need assistance. 【Features】 ■ High-performance compact printing machine ■ High-quality printing with a repeat positioning accuracy of (6σ) ±0.010mm ■ High-speed printing with a cycle time of 8S plus printing time ■ Supported substrate sizes from a maximum of L510×W460(mm) to a minimum of L50×W50 *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment

The "YSP" is a high-end printing machine that is fast, high-precision, and multifunctional. It achieves a high-speed printing performance of 11 seconds per cycle. It supports a printing range of L600mm. Please feel free to contact us when you need assistance. 【Features】 ■ High-speed, high-precision, multifunctional high-end printing machine ■ High-speed printing performance: 11 seconds per cycle ■ Supports printing range of L600mm ■ Compatible with "L510×W460 board size" *For more details, please refer to the PDF materials or feel free to contact us.

• Soldering Equipment

The "FPD-300UD" is an automatic soldering machine that supports printed circuit boards with a maximum size of L410×W310(mm) to a minimum size of L100×W100. It is capable of mass production with three transport carriers (760 carriers in 8 hours). Additionally, it supports mixed production of different types and quantities. Please feel free to contact us when you need assistance. 【Features】 ■ Supported board size: Maximum L410×W310(mm) to minimum L100×W100 ■ Mass production with three transport carriers (760 carriers in 8 hours) ■ Control over preheating, soldering, and solder removal speeds, etc. ■ Supports mixed production of different types and quantities (individual condition settings for each of the three carriers) *For more details, please refer to the PDF document or feel free to contact us.

• Soldering Equipment

We would like to introduce the "Production Process" of VEMS Corporation. We provide a consistent system from circuit board design to delivery and ancillary services. The manufacturing (assembly) processes such as circuit board mounting, inspection, and DIP are carried out with well-equipped facilities. Please feel free to contact us when you need our services. 【Production Process】 1. SMT Line Configuration 2. Mounting Inspection 3. Manual Soldering 4. Assembly and Electrical Inspection *For more details, please refer to the PDF document or feel free to contact us.

• Other services

At VEMS, we refer to our consistent system that accommodates multi-variety, small-lot production—from procurement and PCB assembly to inspection—as "Variable Production." "Variable" means changeable; in other words, in response to the diversification of customer specifications and quantities, it signifies the automation and structuring of production with flexibility, without fixing the products produced on the production line. By manufacturing a greater variety of products in the necessary quantities as needed, we can reduce the space and management effort required for customers to maintain large stocks. Additionally, VEMS's Variable Production allows for flexible production of multiple specifications without mixing, by switching personnel and setups within a certain range, without significantly changing production equipment or setups based on the products being produced, in response to demand fluctuations and customer preferences. This also contributes to reducing lead times for our customers. *For more details, please refer to the PDF document or feel free to contact us.*

• Other electronic parts
• Contract manufacturing

VEMS Corporation is a company that manufactures industrial electronic equipment. We can carry out consistent production from circuit board assembly to final assembly. By performing the entire process from surface mounting and hand soldering to assembly and inspection, we contribute to reducing lead times and management workload. Equipped with advanced facilities for circuit board assembly, we cater to a diverse range of customer needs, from small-batch production of various types to mass production. Based on high quality, short delivery times, and low costs, we provide products that satisfy our customers. 【Business Description】 ■ Manufacturing of industrial electronic equipment *For more details, please refer to the PDF document or feel free to contact us.

• Other electronic parts
• Contract manufacturing