UDinfo, M.2 2242 PCIe industrial SSD (3D TLC/3D pSLC), extended temperature -40 to 85°C, supports 1TB.
Features ■ SATA Revision 3.2, SATA Gen3/Gen2/Gen1 interface ■ Capacity 3D TLC: 64GB to 1TB, 3D pSLC: 32GB to 256GB ■ Dimensions: 42(L) x 22(W) x 3.8(H) ■ Based on 3D-TLC NAND flash, achieving high performance with up to 550MB/s read and 340MB/s write ■ S.M.A.R.T (Self-Monitoring, Analysis, and Reporting Technology) ■ Conformal coating (insulation protective coating)
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basic information
Specifications - Type: 3D TLC/3D pSLC - Interface: SATA Revision 3.2, SATA Gen3/Gen2/Gen1 interface - Operating Voltage: 3.3V - Capacity: 3D TLC: 64GB to 1TB, 3D pSLC: 32GB to 256GB - Read Speed: 550MB/s (maximum) - Write Speed: 510MB/s (maximum) - Vibration Resistance: 20G @80–2000Hz - Shock Resistance: 1500G @0.5ms - Operating Temperature: 0 to 70℃ (standard), -40 to 85℃ (extended) - Operating Humidity: 0 to 95% - Dimensions: 42(L) x 22(W) x 3.8(H)mm - Certification: RoHS, CE & FCC
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Applications/Examples of results
- Purpose Industrial computers, embedded devices, automotive equipment - Example of achievements UDinfo's SSD, designed for industrial applications, was adopted by a South Korean railway company for CCTV recording in trains, supporting capacities of 4TB and 8TB (optional), industrial temperature operating range, and power interruption data protection features.
Line up（3）
| Model number | overview |
|---|---|
| M2S-42DCxxxxxxxxxx | 3D TLC, 0～70℃ / -40～85℃ |
| M2S-42DExxxxxxxxxx | 3D TLC / 3D pSLC, 0～70℃ / -40～85℃ |
| M2S-42UBxxxxxxxxxx | SLC / MLC / 2D pSLC / 3D TLC / 3D pSLC, 0～70℃ / -40～85℃ |
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Company information
Currently, Taiwan has become a global supply base for industrial electronic equipment, and we aim to contribute to the development of Japanese industry by providing excellent industrial electronic equipment from Taiwan to Japanese engineers. As a specialized trading company for industrial electronic equipment, we will supply the necessary industrial electronic devices (LCD displays, LCD modules, embedded PCs, AI embedded PCs, panel PCs, CPU boards, measurement and control boards, network devices, video equipment, GPS devices, wireless transmission devices, IoT sensors) to engineers.