Reduce transmission loss with high-speed communication FPC! Thermosetting adhesive sheet that can be stored at room temperature.
"ZLP" is a low-dielectric adhesive material available in adhesive sheet form, which can be bonded with various materials such as copper and polyimide. It is a thermosetting adhesive sheet that can be stored at room temperature, and there are two bonding methods: "roll lamination method" and "sheet quick press method." Due to its low dielectric constant and low dielectric loss tangent, it can reduce transmission loss in high-speed communication FPCs. [Adhesive Curing Conditions] ■ Oven Cure (without pressure): 180°C × 90 min at atmospheric pressure ■ Press Cure (with pressure): 180°C × 90 min at 2.0 MPa *For more details, please refer to the PDF document or feel free to contact us.
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【Basic Physical Properties】 ■Dielectric Constant: 2.8 ■Dissipation Factor: 0.003 ■Adhesion Strength: 1.2 N/mm ■Solder Heat Resistance: Pass ■Water Absorption Rate: 0.2% *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Panac Corporation was established with the intention of challenging ourselves with new businesses that can stay ahead of the times. This involves new domains that have not been part of Panac before, such as next-generation technologies, sustainable businesses, protection of the global environment, and quality of life (QOL). While we are committed to taking on new initiatives, we will not stray from the fundamentals of Panac, which is to always prioritize our customers. We believe it is our mission to listen carefully to even the smallest feedback from our customers and to turn that into something tangible that brings them joy.