【Exhibition Participation】Unique technology that enables fine processing of printed circuit boards.
We will propose solutions tailored to your technical needs! We will respond with our unique technology for fine and thin plate processing, as well as hole processing.
【Exhibition Overview】 38th Nepcon Japan - Electronics Development and Implementation Exhibition - Exhibition Name: 24th Printed Circuit Board EXPO Dates: January 24, 2024 [Wed] to January 26, 2024 [Fri] 10:00 AM to 5:00 PM Venue: Tokyo Big Sight Booth Number: E27-37 At our booth, we will showcase cavity substrates suitable for various sensor devices, ultra-thin high-density substrates with a thickness of 0.0mm, via diameter of Φ0.04mm, and positional accuracy of ±0.025mm that enhance the performance of advanced electronic devices, as well as MSAP high-density substrates with a pattern width of 0.01mm and pattern spacing of 0.025mm achieved through selective plating methods. 【Exhibited Products】 ■ Thin high-density substrate processing technology ■ Cavity substrates ■ MSAP method We will be available for consultations at the technology, quality, and procurement booth. Please feel free to stop by. *For more details, please refer to the PDF document or feel free to contact us.
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Shinko Seisakusho Co., Ltd. operates as a company within the Sumitomo Metal Mining Group, primarily engaged in the development, design, manufacturing, and sales of electronic circuit boards. Our company conducts integrated production across all processes from design to prototype and mass production. Additionally, we not only focus on domestic production but also select overseas OEM partners according to our customers' needs for procurement and sales. If you have any inquiries regarding electronic circuit boards, please feel free to consult with us.