Ultrasonic sieve enabling fine dry classification essential for high-quality battery powder.
Artech ultrasonic sieve machine/ultrasonic hopper/ultrasonic quantitative discharge technology
High-quality battery powder (particle size level of 20μm to 53μm) achieved through dry classification with retrofitted ultrasound on test sieves. There is a proven track record of wet slurry electroforming with a sieve opening of 5μm.
The Artech ultrasonic sieve machine makes it easy to achieve high-mesh dry classification below 50µm, which is difficult with conventional hand sieving or vibrating sieves alone, thereby improving battery quality and significantly enhancing work efficiency. (There are achievements in dry particle size classification at the 20μm level and wet slurry classification in micrometers.) Additionally, the ultrasonic sieve can be easily attached to general-purpose vibrating sieve machines using JIS test sieve frames (such as electromagnetic, motor-driven, and air turbine types). The synergistic effect of different vibration principles (physical ultrasonic vibration from wire mesh and oscillatory vibration from motors, etc.) enables further productivity improvements. The ultrasonic oscillator is also available in explosion-proof specifications compliant with ATEX ZONE 22. *Demo machines are available for free rental. Please contact us if you are interested.
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basic information
**Characteristics and Applications of Artech Ultrasonic Vibration** Unlike the oscillating vibrations of vibrating screens (electromagnetic, motor-driven, etc.), ultrasonic vibrations do not provide an opportunity for powder to adhere to the mesh openings due to the physical micro-vibrations of each metal wire mesh (approximately 35,000 ultra-micro-vibrations per second), thereby preventing clogging. The Artech ultrasonic oscillator generates various ultrasonic applications by sweeping vibrations at the natural resonant frequency of the metal (33kHz to 37kHz). Applications utilizing ultrasonic vibrations: - Ultrasonic sieves: Improved efficiency of high-mesh dry classification, enhanced classification quality, and extended mesh lifespan. *Compatible with existing JIS test sieves (Φ50, 75, 100, 150, 200, 300).* - Ultrasonic hoppers: Measures to counteract productivity loss due to bridging, rat-holing, and wall adhesion, and improvements in segregation discharge. - Powder transport: Improvement of adhesion issues within powder transport piping (enhanced adhesion prevention in screw feeders and pneumatic transport). - Powder quantitative discharge: Enables uniform powder accumulation through quantitative discharge of powder without clogging. Additionally, metal transport paths free from adhesion due to ultrasonic micro-vibrations can transform into ultrasonic transport paths, allowing for the quantitative supply of fine powders.
Price information
The price varies depending on the equipment specifications, so please feel free to contact us.
Delivery Time
P4
Applications/Examples of results
【Applications】 ■ Battery materials ■ Coatings ■ Metal materials ■ Resin materials ■ Pharmaceutical materials/Food materials ■ Toner ■ Chemical products etc. *For more details, please refer to the PDF document or feel free to contact us.
Line up（1）
| Model number | overview |
|---|---|
| DGS35kHz | Ultrasonic oscillator 35kHz frequency 50W/100W/200W |
catalog（3）
Download All Catalogs![[Latest Edition] Free Comprehensive Catalog from UC Japan Co., Ltd.](https://image.mono.ipros.com/public/catalog/image_generated/01/d75/364145/364145_IPROS6167932514340624170_1.jpg?w=120&h=170)
![Ultrasonic sieve machine [suitable for transportation, supply, cleaning, and molds!]](https://image.mono.ipros.com/public/catalog/image/01/0e3/33836/IPROS17583223056302832027.PNG?w=120&h=170)
Company information
UC Technology Inc. (USA) has been at the forefront of ultrasonic technology since 1966, advancing alongside semiconductor manufacturing equipment. After establishing UC Japan Co., Ltd. in 1990, we developed strong relationships with major semiconductor manufacturing equipment manufacturers in Japan, primarily focusing on OEM supply for numerous wire bonders and flip chip bonders, building trust and a solid track record. Since 2005, we have collaborated with our sister companies, including Lincos (Switzerland), Artec (Switzerland), Crest (USA), Martin Walter (Germany), and KLN (Germany), and have also begun handling various ultrasonic applications. To support global efforts to address environmental and energy issues, we prioritize meeting requirements such as efficiency, lightweight design, miniaturization, strength, airtightness, and reproducibility. We value experimental verification with our customers and continuously propose ultrasonic solutions necessary for creating the future of manufacturing. Please feel free to consult with us.