Reduce pattern erosion at low flow rates! It can also accommodate soldering of long lead PCBs.
The "Smart Dip Return Back Type FZH-4639" is an automatic soldering device that utilizes our patented technology. Thanks to the stirring mechanism (our patented technology), it enables uniform and reproducible soldering. The low flow velocity of the generated waves makes it less likely for copper erosion to occur with lead-free solder. The workpiece returns to the input port, allowing for one-man operation. The operator can remove the workpiece and prepare the next workpiece, such as inserting components, while it returns to their hands. 【Features】 ■ Low flow velocity soldering ■ Compatible with long leads ■ Supports cell production ■ Static tank + stirring soldering method ■ Minimal generation of oxides *For more details, please feel free to contact us.
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basic information
【External Dimensions】 1,360(W)×2,158(D)×1,600(H)mm 【Device Weight】 800kgf 【Work Size】 Substrate external dimensions 330(W)×400(D)mm *Substrate transport 【Solder Tank】 Stainless steel (nitrided) 【Solder Capacity】 290kg 【Preheater】 IR panel heater (2 zones) 【Number of Registered Models】 100 models
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FA Shinka Technology Co., Ltd. designs, manufactures, and sells automatic soldering equipment and related assembly equipment. Our devices, which pursue stability in quality and ease of use through proprietary patented technology, have become the foundation of manufacturing worldwide, both domestically and internationally.