Automatic Soldering Device Smart Dip II

Realization of high quality and high stability through patented technology.

The "Smart Dip II FXM-1" is an automatic soldering device that achieves high quality and high stability. It generates waves through a stirring mechanism (our patented technology) to promote heat exchange and perform soldering. This maintains the advantages of reduced oxide generation in the stationary tank and high maintainability while improving weaknesses such as the fragility of through-hole connections. Due to the low flow rate of the generated waves, this method minimizes the occurrence of copper erosion. 【Features】 ■ High quality and high stability ■ Digital control allows for a variety of condition settings ■ Standard equipped with automatic setup change using QR codes ■ Reduces daily maintenance time ■ Low oxide generation allows for reduced running costs *For more details, please feel free to contact us.

Soldering Equipment