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  6. Electrolytic Ni·Pd·Au plating

Electrolytic Ni·Pd·Au plating

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last updated:Feb 19, 2024

友電舎 本社、工場
友電舎 本社、工場
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Enhance secondary implementability with solder!

By providing a Pd plating layer as a barrier layer in between, the exposure of Ni to the Au surface can be more effectively controlled. Additionally, by incorporating a Pd layer, the Au plating can be made thinner, which enhances the secondary mounting capability with solder. This addresses the disadvantages of electroless Ni-Pd-Au plating. 【Disadvantages of Electroless Plating】 - Cannot achieve thick film deposition. - Material loss occurs due to liquid renewal. - Long processing time leads to poor productivity. - There are limitations on the specifications of the electroless Ni substrate. ↓ ↓ ↓ 【Electrolytic Plating】 - Processing is possible regardless of film thickness. - Low material loss results in lower running costs. - Short processing time allows for improved productivity and reduced processing costs. - No restrictions on the substrate, allowing for options beyond Ni. 【Features】 - Electrolytic Ni: No restrictions on film thickness; can accommodate non-magnetic purposes even with a Cu substrate. - Electrolytic Pd: Film thickness can be adjusted according to specifications; prevents diffusion of the underlying Ni layer due to heat resistance (barrier layer). - Electrolytic Au: No restrictions on film thickness; good WB properties and solder joint reliability; suitable for semiconductor components.

    Printed Circuit BoardProcessing ContractSurface treatment contract service
image-case14.jpg

Electrolytic Ni·Pd·Au plating

image-case14.jpg
image-case14.jpg
  • Related Link - https://www.ydn.co.jp/technology/case-denkai-nipda…

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basic information

【Corresponding Materials】 Cu-based / Fe-based / SUS-based aluminum / Ni / Mo / W / Ti / Metallized products (sputtered, brazed products, etc.)

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Applications/Examples of results

Semiconductor components / various substrates / glass hermetic products / contact components / composite components, etc.

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Electrolytic Ni·Pd·Au plating

Electrolytic Ni·Pd·Au plating

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友電舎

友電舎 本社、工場

Manufacturing and processing contract

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The slogan is "Challenge the Impossible." We are a technology development-oriented company that broadly develops unique surface treatment technologies to meet the special needs required for essential low-voltage components (related to electricity, electronics, and semiconductors), high-voltage components (such as high-voltage connectors), and insulating components. Additionally, we have established a support system that incorporates functional surface treatments, which we have cultivated since our founding, as our core technology, along with processes such as pressing, heat treatment, painting, and assembly. We will continue to deliver consistent Yuden-sha brand technologies and products to the world. *We support online business meetings.

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