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  6. High-frequency substrate manufacturing processing example: Back drilling method

High-frequency substrate manufacturing processing example: Back drilling method

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last updated:Feb 20, 2024

松和産業 本社
松和産業 本社
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Minimize noise and signal degradation! Introducing examples of manufacturing processes using the back drill method.

We would like to introduce an example of manufacturing and processing using the "Back Drill Method." This method involves the removal of TH stubs, minimizing noise and signal degradation that can hinder high-speed transmission. It is effective in equalizing signal propagation speed, reducing reflections in transmission lines, and minimizing attenuation. Please feel free to contact us when you need assistance. 【Components】 ■ TH Stub ■ Back Drill ■ TH Stub Removal *For more details, please refer to the PDF document or feel free to contact us.

    Circuit board design and manufacturing
【高周波基板製造加工例】バックドリル工法1.PNG

High-frequency substrate manufacturing processing example: Back drilling method

【高周波基板製造加工例】バックドリル工法1.PNG
【高周波基板製造加工例】バックドリル工法1.PNG
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Examples of manufacturing and processing of high-frequency substrates

Examples of manufacturing and processing of high-frequency substrates

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松和産業

松和産業 本社

Electronic Components and Semiconductors

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Our entire staff takes responsibility and consistently manufactures all processes of printed circuit board production in our own factory, enabling us to respond to short delivery times that others cannot achieve. We provide a wide variety of printed circuit boards, from single-sided to high multilayer, for applications such as musical instruments, toilets, mobile phones, automotive, and space development. We possess state-of-the-art equipment and can also accommodate short delivery times for high-difficulty boards and flexible boards. Our motto is "Change & Challenge." We are not afraid of transformation and will continue to challenge ourselves! Please feel free to contact us with your requests. Remote face-to-face meetings are also possible!

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