Specialized Book: Material Technologies and Evaluation Guidelines Required in the Beyond 5G/6G Era
Guidelines for the design of materials for Beyond 5G/6G compatibility, explained alongside examples and trends in the development of each material, as well as evaluation technologies.
- Overview of the market and the fundamental knowledge of high frequency necessary for involvement in 5G/6G. - What are the required characteristics and design policies for high performance of each component in preparation for Beyond 5G/6G? ⇒ Shielding materials, electromagnetic wave absorbing materials, polyimide resins, materials for printed wiring boards/substrates, 3D printing materials, fluororesin substrates, film materials, resin hardeners, foams, etc. ⇒ What are the necessary conditions for materials such as transmission loss, relative permittivity, dielectric loss tangent, flame retardancy, processability, etc.? What are the selection criteria for materials? ⇒ Composition of components and the reasons for it, design design, manufacturing methods, evaluation results, etc. - Measurement methods for dielectric properties and how to differentiate them, measurement and calculation methods for permittivity/relative permittivity/dielectric loss tangent. - Methods for improving interfacial adhesion and adhesion, technologies for enhancing the adhesion of difficult-to-bond materials through surface treatment, packaging technologies in 5G/6G, etc.
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basic information
○Publication Date: March 2024 ○Format: B5 size, 309 pages Chapter 1: Trends and Standardization Scenarios of 5G/6G Chapter 2: Fundamental Knowledge of High-Frequency Engineering Necessary for Understanding 5G/6G Chapter 3: Low Dielectric Material Technologies and Required Characteristics of Various Materials Section 1: Overall Direction and Design Guidelines for Required Characteristics, Parameters, and Additional Functionalities on the Component Side Section 2: Design Considerations and Development Cases for Electromagnetic Wave Absorbers in 5G/6G Applications Section 3: Concepts and Basic Design of Electromagnetic Wave Absorbers in the 5G/B5G Gigahertz Band Section 4: High-Frequency Corresponding Technologies for Each Material Section 5: Material Evaluation Chapter 4: Adhesion, Joining, and Processing Technologies Section 1: Interface Adhesion Strength of High-Frequency Substrate Materials and Conductors for 5G/Beyond 5G Communication Section 2: Technologies for Improving Adhesiveness of Fluororesins Section 3: Methods for Enhancing Adhesion of Difficult-to-Bond Materials through Surface Modification Section 4: Adhesive-Free Direct Bonding Technology through Plasma Surface Modification Section 5: Packaging Technologies for 5G/6G
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○List price: ¥66,000 (including tax (10% consumption tax))
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P2
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P1
※Orders placed by 3 PM will be shipped on the same day (for published products only).
Applications/Examples of results
Recommended for the following individuals: - Those who want to understand the material properties and requirements needed for high-speed and large-capacity communication. - Those who want to learn about transmission loss, dielectric loss, and conductor loss. - Those who want to know about bonding and joining technologies from the basics to applications.
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The information organization aims to contribute to the development of the industry through technical seminars on chemistry, pharmaceuticals, electronics, machinery, environment, cosmetics, food, etc., as well as the publication of technical books, correspondence courses, and DVDs that record seminars.
