High thermal conductivity, low expansion, high rigidity, strong bonding, good weldability.
AlSiC substrates are widely used in equipment equipped with high-power IGBT modules due to their excellent thermodynamic and mechanical properties.
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basic information
Material: AlSiC Volume fraction (Vol%): 65~70 Thermal conductivity (W/m·K): 200±20 Coefficient of thermal expansion (×10-6/K): 6.5~9 Electrical conductivity (mS/m): >6 Density (g/cm3): 2.97~3.1 Copper plating (μm): 8~12 Gold plating (μm): >1.3
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Applications/Examples of results
Substrate-related products are applied in fields such as railways, smart grids, and power electronics.
Company information
Toyoko Corporation was established in 2011, and the semiconductor business of Toyoko Chemical began in 2015. While generative AI continues to advance, our lives have become significantly more convenient due to the progress of IT and electronics technology, encompassing not only computers, smartphones, and tablets but also automobiles and home appliances. In the field of electronic materials and battery materials, we provide unique and high-value-added products that leverage our silicon wafer processing for the electronics industry. Focusing on supporting Japanese manufacturing, we have built a network for the production and sale of goods, and since 2022, we have separated our manufacturing and trading businesses to maximize profits through business expansion. Business Features: A manufacturing, processing, and sales network primarily developed in Asia and North America. Regional Revitalization: In the specialized fields of "semiconductor materials and battery materials," we also contribute to the revitalization of local economies. We actively seek local companies across Japan with whom we can establish good partnerships. With years of accumulated experience and expertise, we carefully select only those products that have been validated over a long period and provide them to users in local areas, universities, and research institutes.
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