Efficiently dissipate heat from the copper coin to the back side! It is possible to reduce the heat generation of the entire circuit board.
We would like to introduce our high thermal conductivity substrate, the "Copper Inlay Substrate [Copper Coin]." Among the diverse electronic components, there are some that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, we offer substrates embedded with copper coins. 【Features】 ■ Efficiently dissipates heat to the backside by incorporating copper coins ■ Reduces overall heat generation of the substrate *For more details, please refer to the PDF document or feel free to contact us.
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Leave the design and manufacturing of printed circuit boards to us! <Sanwa Electronics Circuit Company Information>
![High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin] - Thick Copper Substrate"](https://image.mono.ipros.com/public/catalog/image/01/d07/317138/IPROS2918469235876260107.jpeg?w=120&h=170)
High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin] - Thick Copper Substrate"
Company information
Sanwa Electronic Circuit produces printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, computers, wireless devices, ETC, automotive equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies specializing in circuit boards, we integrated these companies in 2004 and launched as Sanwa Electronic Circuit Co., Ltd. with a new divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a dedicated printed circuit board company for over half a century, advancing alongside the progress of printed circuit boards. We sincerely appreciate your continued support and patronage.
