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  1. Home
  2. Electronic Components and Semiconductors
  3. 三和電子サーキット
Electronic Components and Semiconductors
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三和電子サーキット

addressOsaka/Higashisumiyoshi-ku, Osaka-shi/3-28-1 Sōzu
phone06-4301-1531
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last updated:Dec 03, 2024
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  • Company information
  • Products/Services(40)
  • catalog(16)
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三和電子サーキット Company Overview

We will take on and respond to all kinds of special substrates.

Sanwa Electronic Circuit produces printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, computers, wireless devices, ETC, automotive equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies specializing in circuit boards, we integrated these companies in 2004 and launched as Sanwa Electronic Circuit Co., Ltd. with a new divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a dedicated printed circuit board company for over half a century, advancing alongside the progress of printed circuit boards. We sincerely appreciate your continued support and patronage.

Business Activities

【Design】 Pattern design, CAD design, SI analysis, PI analysis 【Products】Printed circuit boards (PCBs) Single-sided boards, double-sided boards, multilayer boards, build-up boards, IVH boards Device boards, flexible boards, aluminum base boards, aluminum boards Heat dissipation boards, copper inlay boards (copper coin boards), back drill boards High-frequency boards, fluororesin boards, impedance control boards Ultra-thin printed circuit boards, edge-plated through-hole boards 【Assembly】 Prototype assembly support

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Products/Services (40)

Can you find hints for improving manufacturing with special substrates? [Materials available for distribution] product image
Can you find hints for improving manufacturing with special substrates? [Materials available for distribution]
[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending! product image
[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!
End face through-hole substrate. Our unique processing solves copper burrs and powder drop! product image
End face through-hole substrate. Our unique processing solves copper burrs and powder drop!
Achieving high-density implementation and high heat dissipation. New possibilities with copper inlay substrates. product image
Achieving high-density implementation and high heat dissipation. New possibilities with copper inlay substrates.

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catalog(16)

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SEC special printed circuit board materials

SEC special printed circuit board materials

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Introduction to SEC Special Substrates

Introduction to SEC Special Substrates

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Introduction of SEC special substrates

Introduction of SEC special substrates

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End face electrode (end face through hole, burr prevention, soldering measures)

End face electrode (end face through hole, burr prevention, soldering measures)

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Detailed information

Company name 三和電子サーキット
Contact addresspostalcode 546-0041 Osaka/ Higashisumiyoshi-ku, Osaka-shi/ 3-28-1 SōzuView on map TEL:06-4301-1531 FAX:06-4301-1537
Industry Electronic Components and Semiconductors
三和電子サーキット Building Image

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