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  6. [Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

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last updated:Feb 06, 2025

三和電子サーキット
三和電子サーキット
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Using FR-4 material with a thickness of 0.1mm or less, it can be bent and used like a flexible circuit board. Initial costs can be addressed at a low price.

Our "Thin Plate Bending Circuit Board" uses glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, making it suitable for applications that require several bending actions during bending and assembly. Thanks to router processing, there is no need for coverlay processing molds or outline processing molds. This helps reduce initial costs from prototyping to mass production, allowing for cost-effective manufacturing of products. It is suitable for circuit boards that require component mounting and bending, and can be used in industrial equipment, LED lighting, and wearable devices (such as VR headsets and controllers). 【Features】 - Ideal for applications that require several bending actions during bending and assembly. - More cost-effective in terms of product and initial costs compared to flexible circuit boards (when compared to our offerings). - No need for coverlay processing molds or outline processing molds. - Capable of handling small to medium production volumes. *For more details, please refer to the materials. Feel free to contact us with any inquiries. *Materials for special circuit boards other than thin plate bending circuit boards can also be viewed via download.

    Printed Circuit Board
2校_1007_se-circuit_550_550_2046758.jpg

[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

2校_1007_se-circuit_550_550_2046758.jpg
2校_1007_se-circuit_550_550_2046758.jpg
  • Related Link - https://se-circuit.co.jp/

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basic information

【Specifications】 Number of layers: Single-sided / Double-sided Board thickness: 0.06 to 0.1 mm Flexural resistance (in accordance with JISC5016): Board thickness 0.06t: 1000 times at R5 Board thickness 0.1t: 500 times at R5 Minimum bending radius: Can be bent up to 5 times at R1.5 Surface treatment: Heat-resistant preflux, electroplated and electroless gold plating Shape processing: Router compatible *For more details, please refer to the materials. Feel free to contact us with any inquiries.

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*For more details, please refer to the materials. Feel free to contact us as well.*

catalog(3)

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Leave the design and manufacturing of printed circuit boards to us! <Sanwa Electronics Circuit Company Information>

Leave the design and manufacturing of printed circuit boards to us! <Sanwa Electronics Circuit Company Information>

COMPANY
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Substrate Variations <Flexible Substrates / Thin Plate Bending Substrates>

Substrate Variations <Flexible Substrates / Thin Plate Bending Substrates>

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Introduction to SEC Special Substrates

Introduction to SEC Special Substrates

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Company information

三和電子サーキット

三和電子サーキット

Electronic Components and Semiconductors

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Sanwa Electronic Circuit produces printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, computers, wireless devices, ETC, automotive equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies specializing in circuit boards, we integrated these companies in 2004 and launched as Sanwa Electronic Circuit Co., Ltd. with a new divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a dedicated printed circuit board company for over half a century, advancing alongside the progress of printed circuit boards. We sincerely appreciate your continued support and patronage.

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