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  6. Thin plate bending substrate

Thin plate bending substrate

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last updated:Feb 06, 2025

三和電子サーキット
三和電子サーキット
  • Official site

Surface treatment includes heat-resistant preflux and electroplating/non-electrolytic gold plating! Compatible with routers.

The "Thin Plate Bending Substrate" is a substrate that serves as an alternative to flexible substrates, using thin glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, which are used for several bends or bending during assembly. Applications include LED lighting substrates used on curved surfaces, substrates that require component mounting and bending, and substrates for connections between boards, all suitable for several bends. Please feel free to contact us when you need assistance. 【Specifications (partial)】 ■ Number of layers: Single-sided / Double-sided ■ Thickness: 0.06 to 0.1mm ■ Minimum bending radius: Can be bent up to 5 times at R1.5 ■ Outline processing: Router compatible *For more details, please refer to the PDF document or feel free to contact us.

    Printed Circuit Board
薄板曲げ基板.PNG

Thin plate bending substrate

薄板曲げ基板.PNG
薄板曲げ基板.PNG
  • Related Link - https://se-circuit.co.jp/technology/

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【Other Specifications】 ■ We can accommodate small quantities. It is possible to reduce initial costs without the need for a die. ■ Surface treatment: heat-resistant preflux, electrolytic and non-electrolytic gold plating ■ Bend resistance (compliant with JISC5016) ・ Thickness 0.06t: 1000 cycles at R5 ・ Thickness 0.1t: 500 cycles at R5 *For more details, please refer to the PDF document or feel free to contact us.

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【Usage】 ■ LED lighting boards for use on curved surfaces ■ Boards that require component mounting and bending ■ Connection boards between substrates, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Substrate Variations <Flexible Substrates / Thin Plate Bending Substrates>

Substrate Variations <Flexible Substrates / Thin Plate Bending Substrates>

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Substrate Variations <Functional Step Substrate / Ultra-Thin Rigid Substrate>

Substrate Variations <Functional Step Substrate / Ultra-Thin Rigid Substrate>

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三和電子サーキット

三和電子サーキット

Electronic Components and Semiconductors

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Sanwa Electronic Circuit produces printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, computers, wireless devices, ETC, automotive equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies specializing in circuit boards, we integrated these companies in 2004 and launched as Sanwa Electronic Circuit Co., Ltd. with a new divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a dedicated printed circuit board company for over half a century, advancing alongside the progress of printed circuit boards. We sincerely appreciate your continued support and patronage.

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