Using thick copper foil of 105μm or more! We provide substrates that enhance large current and heat dissipation.
We would like to introduce our high thermal conductivity substrate, the "Thick Copper Substrate." By increasing the copper thickness, it becomes possible to carry more current and improve heat dissipation. We offer substrates that enhance high current and heat dissipation by using copper foil thicker than 105μm. 【Product Lineup】 ■ Double-sided Printed Circuit Boards - Copper foil thickness: 70, 105, 140, 175μm ■ Multilayer Printed Circuit Boards - Copper foil thickness (outer layer, inner layer): 70, 105μm *For more details, please refer to the PDF document or feel free to contact us.
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Leave the design and manufacturing of printed circuit boards to us! <Sanwa Electronics Circuit Company Information>
![High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin] - Thick Copper Substrate"](https://image.mono.ipros.com/public/catalog/image/01/d07/317138/IPROS2918469235876260107.jpeg?w=120&h=170)
High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin] - Thick Copper Substrate"
Company information
Sanwa Electronic Circuit produces printed circuit boards used in various aspects of daily life, including smartphones, car navigation systems, computers, wireless devices, ETC, automotive equipment, and medical devices. Our company was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. After expanding production and sales through four group companies specializing in circuit boards, we integrated these companies in 2004 and launched as Sanwa Electronic Circuit Co., Ltd. with a new divisional structure. During this time, thanks to the guidance and support of our clients, we have developed and grown as a dedicated printed circuit board company for over half a century, advancing alongside the progress of printed circuit boards. We sincerely appreciate your continued support and patronage.