Introducing the characteristics of the "cutting" method, including processes and examples of processing.
This document explains "splitting," which is one of the cutting processes. It introduces features, differences from conventional methods, our main equipment, and the materials that can be processed. Additionally, we have included photos as examples of processing for each material, so please take a moment to read through it. 【Contents (partial)】 ■ Company Introduction ■ What is "Splitting"? ■ Features of "Splitting" ■ Process of "Splitting" *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Other Published Content】 ■Differences from Conventional Methods ■Main Equipment ■Processable Materials / Processable Shapes ■Collaborative Partners / Chip Sales ■Processing Examples *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Download All Catalogs![[Data] "Fracturing" brittle materials such as glass, ceramics, and semiconductors.](https://image.mono.ipros.com/public/catalog/image/01/736/748343/IPROS30543311296765039603.jpeg?w=120&h=170)
Company information
Our company offers contract processing and chip sales of brittle materials using the new cutting technology "Scribe & Break." The advantages of "Scribe & Break" include 1) dry processing (no cleaning required), 2) no kerf loss, 3) reduced chipping and burrs, and 4) no thermal effects, among many others. We are particularly skilled in processing materials such as glass, ceramic substrates, and semiconductors (especially SiC and sapphire), so please feel free to entrust us with your needs. We respond to customer needs ranging from processing for test specimen production to product prototyping and mass production, cutting various materials. Please do not hesitate to contact us with your requests.