ブリマテック Company Profile

If you need contract cutting processing for brittle materials, leave it to us! We offer dry processing with no cutting waste and significantly reduced chipping!

Our company offers contract processing and chip sales of brittle materials using the new cutting technology "Scribe & Break." The advantages of "Scribe & Break" include 1) dry processing (no cleaning required), 2) no kerf loss, 3) reduced chipping and burrs, and 4) no thermal effects, among many others. We are particularly skilled in processing materials such as glass, ceramic substrates, and semiconductors (especially SiC and sapphire), so please feel free to entrust us with your needs. We respond to customer needs ranging from processing for test specimen production to product prototyping and mass production, cutting various materials. Please do not hesitate to contact us with your requests.