No need for grinding water or cleaning! There is a possibility that the product's functionality will improve.
Let me introduce the features of "cutting." In terms of productivity, it has the potential to increase the number of products handled and shorten the takt time and delivery deadlines. Additionally, regarding product quality, it has the potential to improve product defects and eliminates defects caused by thermal history. 【Features】 ■ Completely dry processing ■ No car flows ■ High-speed processing ■ Reduced chipping ■ Reduced burrs on metal films ■ No thermal effects *For more details, please refer to the PDF document or feel free to contact us.
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Download All Catalogs![[Data] "Fracturing" brittle materials such as glass, ceramics, and semiconductors.](https://image.mono.ipros.com/public/catalog/image/01/736/748343/IPROS30543311296765039603.jpeg?w=120&h=170)
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Our company offers contract processing and chip sales of brittle materials using the new cutting technology "Scribe & Break." The advantages of "Scribe & Break" include 1) dry processing (no cleaning required), 2) no kerf loss, 3) reduced chipping and burrs, and 4) no thermal effects, among many others. We are particularly skilled in processing materials such as glass, ceramic substrates, and semiconductors (especially SiC and sapphire), so please feel free to entrust us with your needs. We respond to customer needs ranging from processing for test specimen production to product prototyping and mass production, cutting various materials. Please do not hesitate to contact us with your requests.