It is possible to shorten the lead time and delivery schedule! There is a possibility of improving product defects.
"Splitting" refers to one of the cutting processes. After scoring the glass with a glass cutter, it is separated by hand with a snap. This is "splitting." Our company performs this "splitting" with high precision using machinery. Please feel free to contact us when you need our services. 【Features】 ■ Completely dry processing ■ No car-frost ■ High-speed processing ■ Reduced chipping ■ Reduced burrs on metal films ■ No thermal effects *For more details, please refer to the PDF document or feel free to contact us.
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【Process】 1. Scribe Process 2. Break Process 3. Expand *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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Download All Catalogs![[Data] "Fracturing" brittle materials such as glass, ceramics, and semiconductors.](https://image.mono.ipros.com/public/catalog/image/01/736/748343/IPROS30543311296765039603.jpeg?w=120&h=170)
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Our company offers contract processing and chip sales of brittle materials using the new cutting technology "Scribe & Break." The advantages of "Scribe & Break" include 1) dry processing (no cleaning required), 2) no kerf loss, 3) reduced chipping and burrs, and 4) no thermal effects, among many others. We are particularly skilled in processing materials such as glass, ceramic substrates, and semiconductors (especially SiC and sapphire), so please feel free to entrust us with your needs. We respond to customer needs ranging from processing for test specimen production to product prototyping and mass production, cutting various materials. Please do not hesitate to contact us with your requests.