It supports high-speed discharge with a dot diameter of Φ150μm. It enables soldering in fine areas that are difficult to handle manually!
The "winDot-F005-NP303" is a solder paste for fine jet dispensing that simultaneously achieves both fine application and meltability. It realizes one of the smallest application diameters in the world, with no clogging issues. It is suitable for components with three-dimensional structures that are difficult to print, as well as for fine components during simultaneous mounting of large and small parts, and for substrates that are challenging to print (such as warping and expansion). 【Application Products】 ■ MID components ■ Component mounting on cavity substrates ■ High-functionality modules ■ Component mounting on flexible substrates, etc. *For more details, please download the PDF or contact us.
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We provide high-performance solder that meets global standards.