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  6. Moisture Performance Enhanced Solder Paste "EVASOL 1001 Series"

Moisture Performance Enhanced Solder Paste "EVASOL 1001 Series"

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last updated:Jul 22, 2025

石川金属
石川金属
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Achieving wet strengthening while maintaining stability! Capable of supporting various implementations.

Enhanced Wetting Performance The 'EVASOL 1001 Series' strengthens the heat resistance of the flux. It prevents wetting defects due to temperature gaps in mixed assembly of large and small components, as well as incomplete melting in fine patterns. High Storage and Printing Stability This technology controls the reactions within the paste at room temperature, preventing degradation during transport and prolonged printing. Good Wetting with Low Silver With improved heat resistance of the flux, good wetting is achieved even with low silver content. This reduces the impact of metal price fluctuations and enables cost reduction. 【Features】 ■ Good wetting performance under a wide range of conditions ■ High continuous printing stability ■ Excellent transport compatibility *For more details, please refer to the PDF document or feel free to contact us.

    Solder
画像?(1001).jpg

Moisture Performance Enhanced Solder Paste "EVASOL 1001 Series"

画像?(1001).jpg
画像?(1001).jpg
  • Related Link - http://www.ishikawa-metal.com/evasol_detail.php?cd…
  • Special site - Product/service details - https://pr.mono.ipros.com/ishikawa-metal/product/

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basic information

【Specifications】 ■ Compatible solder alloys: J3 (Sn-Ag3.0-Cu0.5), R4 (Sn-Ag0.3-Cu0.7) ■ Powder particle size: 38 to 20µm ■ Flux content: 12.0±1.0% ■ Flux type: MIL-RMA ■ Halide content: 0.02% ■ Copper plate and copper mirror corrosion test: No corrosion ■ Insulation resistance test: 5.0×10^8Ω or more *For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

- Soldering to general circuit boards - Soldering to automotive diodes

Detailed information

  • ぬれ性.JPG

    The "EVASOL 1001 Series" enhances the heat resistance of the flux. It prevents wetting defects due to temperature gaps in mixed assembly of large and small components, as well as incomplete melting in fine patterns.

  • 連続印刷安定性.JPG

    Adopting technology to control reactions inside the paste at room temperature. It can prevent deterioration during long printing times.

  • 輸送対応製.JPG

    Adopting technology to control reactions inside the paste at room temperature. It can prevent deterioration during transportation.

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ぬれ性能強化型ソルダペースト『EVASOL 1001シリーズ』

ぬれ性能強化型ソルダペースト『EVASOL 1001シリーズ』

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石川金属株式会社 会社紹介

石川金属株式会社 会社紹介

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石川金属

石川金属

Ferrous/Non-ferrous metals

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Ishikawa Metal Co., Ltd. is a manufacturer and seller of lead-free and lead-containing solder, consistently engaged in solder production since its establishment. In addition to various types of rosin-core solder and solder paste, we also handle high-melting-point solder for semiconductors and flux for semiconductor mounting. We not only manufacture and sell unique solders, such as rosin-core solder for lasers and solder that can be used for aluminum and stainless steel, but we also propose solutions to customer issues such as splattering and wetting defects.

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