Optoelectronic components

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last updated：Oct 08, 2024

エムシーオー

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Introducing optical communication butterfly packages and low-speed, low-cost HTCC packages!

Our company manufactures and sells "optoelectronic components." We offer a lineup that includes "Min-DiL, Min-Flat & Min-Pin for optical communication with suitable wire wettability plating processing; low-speed and low-cost HTCC packages," as well as "Optica Platform & sub-mount brazing assembly with metal + ceramic using AuSn eutectic pads." Please feel free to contact us when you need our services. 【Features】 <Optica Platform & sub-mount brazing assembly with metal + ceramic> ■ CuW/Heat sink ■ Al2O3, ALN, SiC substrates ■ High-reliability thin-film technology ■ AuSn eutectic pads *For more details, please refer to the PDF materials or feel free to contact us.

Related Link - https://www.mco-mm.jp/%e3%82%aa%e3%83%97%e3%83%88%…

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【Other Features】 <Optical Communication Butterfly Package / HTCC Butterfly Package for 15GHz High-Speed Devices> ■ 65GHz RF Connector Type Package ■ Low-Speed Glass Sealed Package ■ Compatible with 25Ω/50Ω RF Impedance ■ High Thermal Conductivity CuW/CuMo Heat Sink <Optical Communication Min-DiL, Min-Flat & Min-Pin; Low-Speed & Low-Cost HTCC Package> ■ Compatible with 25Ω/50Ω RF Impedance ■ High Thermal Conductivity CuW/CuMo Heat Sink Specifications Available ■ Plating Process Ensuring Good Wire Wetting Properties *For more details, please refer to the PDF document or feel free to contact us.