Introducing optical communication butterfly packages and low-speed, low-cost HTCC packages!
Our company manufactures and sells "optoelectronic components." We offer a lineup that includes "Min-DiL, Min-Flat & Min-Pin for optical communication with suitable wire wettability plating processing; low-speed and low-cost HTCC packages," as well as "Optica Platform & sub-mount brazing assembly with metal + ceramic using AuSn eutectic pads." Please feel free to contact us when you need our services. 【Features】 <Optica Platform & sub-mount brazing assembly with metal + ceramic> ■ CuW/Heat sink ■ Al2O3, ALN, SiC substrates ■ High-reliability thin-film technology ■ AuSn eutectic pads *For more details, please refer to the PDF materials or feel free to contact us.
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【Other Features】 <Optical Communication Butterfly Package / HTCC Butterfly Package for 15GHz High-Speed Devices> ■ 65GHz RF Connector Type Package ■ Low-Speed Glass Sealed Package ■ Compatible with 25Ω/50Ω RF Impedance ■ High Thermal Conductivity CuW/CuMo Heat Sink <Optical Communication Min-DiL, Min-Flat & Min-Pin; Low-Speed & Low-Cost HTCC Package> ■ Compatible with 25Ω/50Ω RF Impedance ■ High Thermal Conductivity CuW/CuMo Heat Sink Specifications Available ■ Plating Process Ensuring Good Wire Wetting Properties *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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MCOR Corporation has been engaged in the manufacturing and sales of silicon wafers, as well as various thin film deposition processes for silicon and metal crystals, quartz processing, and the sales of IC foundries since its establishment in 1994. We respond to our customers' needs with a rich lineup of products.