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  2. Manufacturing and processing contract
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Manufacturing and processing contract
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エムシーオー

addressKanagawa/Kanagawa-ku, Yokohama-shi/7-21 Taimachi, Towa Taimachi Coop 202
phone045-324-6828
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last updated:Apr 08, 2024
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SiC wafers (6-inch/8-inch)

We offer SiC wafers at low cost starting from just one piece! Delivery time is as short as two weeks. We can provide low-priced, small quantities for the development and prototyping of power semiconductors.

"SiC wafers" are a type of wafer that serves as a material for electronic components. Our company can provide SiC wafers at a low cost starting from just one piece. They can be used in the development and prototyping of power semiconductors at low prices and in small quantities. Additionally, we can accommodate delivery times as short as two weeks, so please feel free to contact us. 【Features】 ■ Resistant to breakage even under high electric fields ■ Useful for manufacturing heat-resistant devices ■ Improves the maximum operating temperature of devices ■ Excellent heat dissipation due to high thermal conductivity 【Available Wafers】 8-inch N-type Production 4H-SiC 8-inch N-type Dummy 4H-SiC 6-inch N-type Production 4H-SiC 6-inch N-type Dummy 4H-SiC 6-inch high-purity semi-insulating wafers 4H-SiC 6-inch N-type P-MOS 4H-SiC 6-inch N-type P-SBD 4H-SiC *For more details, please refer to the PDF document or feel free to contact us.

  • Wafer

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【Short delivery time & low price】Silicon wafers 2-6 inches / 8-12 inches

We provide silicon wafers that meet your requirements with short delivery times and low prices! Same-day shipping available.

We handle "silicon wafers" that can be used for applications such as setting conditions for equipment, pre-cutting for dicing saws and BG, and transport testing. In addition to monitor wafers, we can accommodate various sizes and thicknesses, including particle wafers. We also offer 2-inch to 6-inch monitor wafers and 8-inch to 12-inch monitor wafers at competitive prices. Please feel free to consult us regarding P-type/N-type, orientation flat/V-notch, crystal orientation, and more. 【Applications】 ■ Setting conditions for equipment ■ Pre-cutting for dicing saws and BG ■ Transport testing, etc. *For more details, please download the PDF or feel free to contact us.

  • Wafer

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Silicon thin film deposition processing

Thermal oxidation films, patterned films, multilayer films, etc.! Regarding film thickness, we will consult with you each time.

We would like to introduce our "thin film deposition processing." We can process various films, including "thermal oxide films" that can be guaranteed dust-free, "Poly films (non-doped, doped)," "Chicca films (LP, plasma)," and "TEOS films." We will consult with you regarding the film thickness each time. 【Types of Films】 Thermal oxide films (dust-free guarantee available) / Poly films (non-doped, doped) / Chicca films (LP, plasma) *12" is also supported. TEOS films / BPSG films / TI, TIN films / CU films / W films / patterned films / multilayer films / various types of ICs *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Quartz wafers (square wafers and round wafers)

Our quartz wafers can also accommodate grooving, drilling, channeling, and polishing processes.

Single-sided and double-sided polished synthetic quartz substrates can be processed with a maximum diameter of 200mm and a minimum thickness of approximately 0.1mm. 【Features of Synthetic Quartz Substrates】 ■ High transmittance and low thermal expansion rate over a wide range ■ High transmittance in the ultraviolet region *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Crystal wafers (square wafers, round wafers)

Our crystal wafers can also accommodate processes such as grinding, hole drilling, groove processing, and polishing.

We also sell "ST-cut artificial quartz substrates" for research purposes such as MEMS. Please feel free to contact us for AT-cut and others. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract

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Glass wafers (square wafers, round wafers)

Short delivery time and low price! We can accommodate zaguri processing, drilling, groove processing, and more. We also respond to custom orders.

Our company manufactures and sells "glass substrates." These are mainly used for display substrates, ultra-thin glass substrates, and electronic materials for substrates. The glass used as substrates is very thin and requires high durability, so advanced technology is necessary for manufacturing. At MCO, we produce high-quality products with short lead times and low costs, and we also respond to our customers' custom orders. [Types of Glass Substrates] ■ Soda-lime glass ■ Alkali-free glass ■ Borosilicate glass *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing

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Carbon for semiconductors (carbon for power devices)

From foundational fields to cutting-edge fields! We bring out the characteristics of carbon and graphite to the fullest extent.

Our company manufactures and sells "carbon." We utilize innovative ideas and technologies for functional design and advanced processing techniques, maximizing the characteristics of carbon and graphite. At MCO, we respond to a wide range of needs, from foundational fields such as electricity, machinery, and metallurgy to advanced fields like semiconductors and aerospace, with thorough quality control. [Features] ■ Functional design and advanced processing techniques utilizing innovative ideas and technologies ■ A wide variety of needs ■ Thorough quality control *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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Germanium substrate

Substrate materials that demonstrate excellent transmittance in the IR (infrared wavelength range) for semiconductor and electronic device manufacturing!

We manufacture and sell "germanium substrates." These substrate materials exhibit excellent transmittance in the infrared (IR) wavelength range. We offer N-type and P-type germanium substrates (flat polished wafers, diameters of 1, 2, or 3 inches / crystal orientations of 100, 110, or 111) that have been doped during crystal growth for semiconductor and electronic device manufacturing. Please feel free to contact us if you have any inquiries. 【Products Offered】 ■ N-type and P-type germanium substrates *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing

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Optoelectronic components

Introducing optical communication butterfly packages and low-speed, low-cost HTCC packages!

Our company manufactures and sells "optoelectronic components." We offer a lineup that includes "Min-DiL, Min-Flat & Min-Pin for optical communication with suitable wire wettability plating processing; low-speed and low-cost HTCC packages," as well as "Optica Platform & sub-mount brazing assembly with metal + ceramic using AuSn eutectic pads." Please feel free to contact us when you need our services. 【Features】 <Optica Platform & sub-mount brazing assembly with metal + ceramic> ■ CuW/Heat sink ■ Al2O3, ALN, SiC substrates ■ High-reliability thin-film technology ■ AuSn eutectic pads *For more details, please refer to the PDF materials or feel free to contact us.

  • Contract manufacturing
  • Other electronic parts

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Sapphire wafer

Expecting a wide range of applications! We will supply according to the customer's needs and specifications.

Our company manufactures and sells "sapphire wafers." These products possess a Mohs hardness of 9, a melting point higher than quartz (2,053°C), and excellent plasma resistance, as well as superior optical, chemical, and electrical properties. We supply ingots and wafers made using various methods such as Kyropoulos, CZ, and HEM, tailored to our customers' applications and specifications. 【Specifications (partial)】 <2 inches> ■ Material: >99.996% high-purity alumina ■ Quality: Defect-free (No Cracks, Pores, Scratches, Inclusions, Twins) ■ Diameter: 50.8±0.1mm ■ Thickness: 430±15um ■ Crystal orientation: C-plane (0001) ±0.25° *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • aluminum

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GaN substrate

The wide bandgap, fast switching speed, and low on-resistance are also advantageous points!

We manufacture and sell "GaN substrates." These substrates use GaN (gallium nitride), a semiconductor that became widely known as a material for blue light-emitting diodes. However, due to its high breakdown electric field strength and thermal conductivity, it has recently been applied as a material for advanced power semiconductors. Please feel free to contact us when you need our services. 【Basic Specifications (Partial)】 ■ Diameter: Φ2", Φ3", Φ4", Φ6" ■ GaN Film Thickness: 3μm, 3.5μm, 4μm, 4.5μm, 6μm, up to 100μm available upon special request ■ Crystal Orientation: C-axis (0001) ■ Conductivity Type: Un-Doped, N-type, P-type ■ XRD: (002) ≦ 300 arcsec, (102) ≦ 400 arcsec *For more details, please refer to the PDF document or feel free to contact us.

  • Contract manufacturing
  • Other semiconductors

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