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  6. SiC wafers (6-inch/8-inch)

SiC wafers (6-inch/8-inch)

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last updated:Oct 08, 2024

エムシーオー
エムシーオー
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We offer SiC wafers at low cost starting from just one piece! Delivery time is as short as two weeks. We can provide low-priced, small quantities for the development and prototyping of power semiconductors.

"SiC wafers" are a type of wafer that serves as a material for electronic components. Our company can provide SiC wafers at a low cost starting from just one piece. They can be used in the development and prototyping of power semiconductors at low prices and in small quantities. Additionally, we can accommodate delivery times as short as two weeks, so please feel free to contact us. 【Features】 ■ Resistant to breakage even under high electric fields ■ Useful for manufacturing heat-resistant devices ■ Improves the maximum operating temperature of devices ■ Excellent heat dissipation due to high thermal conductivity 【Available Wafers】 8-inch N-type Production 4H-SiC 8-inch N-type Dummy 4H-SiC 6-inch N-type Production 4H-SiC 6-inch N-type Dummy 4H-SiC 6-inch high-purity semi-insulating wafers 4H-SiC 6-inch N-type P-MOS 4H-SiC 6-inch N-type P-SBD 4H-SiC *For more details, please refer to the PDF document or feel free to contact us.

    Wafer
ウエハ.PNG

SiC wafers (6-inch/8-inch)

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  • Related Link - https://www.mco-mm.jp/sic%e3%82%a6%e3%82%a7%e3%83%…

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basic information

SiC wafers are a type of wafer that serves as a material for electronic components, and SiC refers to "silicon carbide," a compound of silicon and carbon. Developed to manufacture more advanced semiconductor devices, SiC wafers possess characteristics that are far superior to traditional silicon wafers. For example, the dielectric breakdown electric field strength is about ten times greater than that of silicon wafers, making them much more resistant to breakdown even under high electric fields. Additionally, the "band gap," which prevents the presence of electrons, is approximately three times wider than that of silicon wafers, aiding in the production of heat-resistant devices. When circuits become hot, electrons can overcome the band gap due to thermal energy, but a significant amount of thermal energy is required to surpass the wider band gap, thus improving the operational temperature limit of the devices. 【Features】 ■ The band gap width is about three times wider compared to silicon. ■ Used not only for various power semiconductors but also as substrates for RF amplifiers and light-emitting diodes (LEDs). * For more details, please refer to the PDF document or feel free to contact us.

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Applications/Examples of results

【Applications】 ■ Power semiconductors and high-brightness LEDs *For more details, please refer to the PDF document or feel free to contact us.

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エムシーオー

エムシーオー

Manufacturing and processing contract

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MCOR Corporation has been engaged in the manufacturing and sales of silicon wafers, as well as various thin film deposition processes for silicon and metal crystals, quartz processing, and the sales of IC foundries since its establishment in 1994. We respond to our customers' needs with a rich lineup of products.

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