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  6. Introduction of plating chemicals for printed circuit boards / semiconductor package substrates.

Introduction of plating chemicals for printed circuit boards / semiconductor package substrates.

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last updated:Apr 25, 2024

奥野製薬工業 大阪・放出、東京、名古屋など
奥野製薬工業 大阪・放出、東京、名古屋など
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[JPCAShow2024] Semiconductor wafers, package substrates, flexible printed circuit boards, surface treatment chemicals and process technologies for power devices.

Okuno Pharmaceutical Industry will exhibit at the JPCA Show 2024, which will be held at Tokyo Big Sight (Tokyo International Exhibition Center) from June 12 (Wednesday) to June 14 (Friday), 2024. With the widespread use of electronic devices, printed circuit boards and semiconductor package substrates are rapidly evolving. We propose surface treatment chemicals and processes that contribute to their high performance and multifunctionality. We will also introduce other new technologies, such as high-reliability granular copper plating with high adhesion to encapsulation resins, lithium dendrite growth suppressants, and plating technologies using recycled materials. Please visit our booth at Tokyo Big Sight, East Hall 6, 6H-08. Only Okuno can do that. To listen to your voices and to be the key to opening up the future, we have continued our journey for 120 years. In the future, Okuno Pharmaceutical Industry will solve any issues related to surface treatment in the electronics field.

    Other surface treatment equipment
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Introduction of plating chemicals for printed circuit boards / semiconductor package substrates.

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奥野製薬工業株式会社.メイン画像.png

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Please leave the surface treatment to Okuno Pharmaceutical Industry. Feel free to contact us.

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TORYZA LCN SP, a plating additive suitable for forming copper pillars on semiconductor wafers and package substrates.

TORYZA LCN SP, a plating additive suitable for forming copper pillars on semiconductor wafers and package substrates.

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Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.

Copper sulfate plating additive for semiconductor wafers, high heat dissipation and high current applications - TORYZA LCN SD.

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Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SV

Copper sulfate plating additive for semiconductor wafers - TORYZA LCN SV

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FOWLP, FOPLP, and copper sulfate plating additives for ultra-fine wiring such as semiconductor package substrates - TORYZA LCN FRV.

FOWLP, FOPLP, and copper sulfate plating additives for ultra-fine wiring such as semiconductor package substrates - TORYZA LCN FRV.

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UBM formation plating process and dedicated equipment for aluminum electrodes on wafers.

UBM formation plating process and dedicated equipment for aluminum electrodes on wafers.

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奥野製薬工業

奥野製薬工業 大阪・放出、東京、名古屋など

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Our company is a research and development-oriented enterprise that supports global manufacturing through science in the fields of surface treatment, inorganic materials, and food. 【Surface Treatment Division】 - We launched a new brand of surface treatment chemicals for semiconductor back-end processes called "TORYZA," offering various plating chemicals and equipment such as copper plating additives for ultra-fine wiring and electroless plating processes for UBM formation. - We propose surface treatment chemicals for plastic plating that provide high added value, such as beautiful metallic appearance, luxury feel, and antibacterial and antiviral properties. - We offer process chemicals for anodizing and dyeing aluminum alloys that beautifully enhance the appearance of casings for smartphones and other devices. We also have environmentally friendly processes and surface treatment chemicals for antibacterial and antiviral applications in our lineup. - We provide electroless nickel plating chemicals and various environmentally friendly products, including low-temperature and long-life types, that impart new functions to materials, such as corrosion resistance, wear resistance, and lubricity. 【Inorganic Materials Division】 Total production from design, processing, to mass production of glass. Contributing to the enhancement of design and functionality with high-quality glass materials. 【Food Division】 Bringing "deliciousness" and "safety" to the dining table. Challenging the development of high-function products composed of food ingredients.

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Introduction of plating chemicals for printed circuit boards / semiconductor package substrates.
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