Adhesive for heat sinks that combines aluminum filler, low viscosity, high adhesion, and thermal conductivity.
Epoxy, Etc.'s 70-3812 NC is an innovative solution for industries requiring excellent thermal conductivity and heat resistance, containing aluminum filler. This epoxy adhesive is designed for bonding parts and materials that require heat resistance, making it a superior material in the market. 70-3812RNC is popular for various heat sink applications due to its good thermal conductivity. Common applications in heat sinks include bonding fins to bases, folding fin sets to bases, pin fin sets to bases, and cold plate tubes to extruded bases. It has passed NASA's low outgassing test (ASTM E-595-07), making it suitable for use in outer space.
Inquire About This Product
basic information
The main characteristics of 70-3812 NC are as follows: - Color: Gray - Viscosity (mixed): 8,000 (mixed) at 25°C - Specific gravity: 1.81 at 25°C - Usable time: 5 hours at 25°C with 100 grams - Durometer: Shore D 90 at 25°C, 65 at 100°C - Tensile strength: 9,000 psi at 25°C - Compressive strength: 18,500 psi at 25°C - Mixing ratio: weight ratio 100:10 - Operating temperature range: -55 to 155°C - Coefficient of thermal expansion: 28 x 10^-6 °C - Thermal conductivity: 4.5 W/m-°K - Outgassing: % TML_0.91, % CVCM_0.07
Price range
Delivery Time
Applications/Examples of results
The 70-3812 NC epoxy system is particularly suited for a wide range of applications in thermal management. For example: heat sink bonding - fins and base, folding fin sets and base, pin fin sets and base, cooling plate tubes and extrusion base. These applications benefit from the epoxy's high thermal conductivity and excellent adhesion, providing efficient heat dissipation and reliability in high-performance environments.
catalog（1）
Download All Catalogs
Company information
Rikei Corporation was established in 1957 and is a solution vendor in the IT and electronics industry, celebrating its 65th anniversary. We propose a variety of solutions centered around cutting-edge technologies and advanced products in the fields of system solutions, network solutions, and electronic components and devices, tailored as the optimal "step-ahead solution" to meet our customers' needs.
