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  1. Home
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  3. Manufacturing and processing machinery
  4. Semiconductor Manufacturing Equipment
  5. Wafer processing/polishing equipment
  6. Grinding processing

Grinding processing

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last updated:May 15, 2024

リード技研
リード技研
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Conducting ultra-precision grinding processing for core pins of molds for mobile phone connectors!

We would like to introduce the "polishing processing" that we conduct. Our specialty lies in the polishing processing of automatic machine molds and mold molds for connectors used in precision machinery such as automobiles, mobile phones, and cameras. We perform high-precision polishing processing for thin, small, and grooved components, as well as ultra-precision polishing processing. 【Features】 ■ We excel in polishing processing for automatic machine molds and mold molds for connectors used in precision machinery such as automobiles, mobile phones, and cameras. ■ We carry out high-precision polishing processing for thin, small, and grooved components. *For more details, please refer to the PDF document or feel free to contact us.

    Wafer processing/polishing equipmentProcessing Contract
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Grinding processing

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  • Related Link - http://lead-giken.co.jp/jigyo/kenma/

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Lead Giken Co., Ltd. Company Profile

Lead Giken Co., Ltd. Company Profile

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リード技研

リード技研

Manufacturing and processing contract

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Our company engages in the processing of press die components, as well as mold die components, automatic machine die components, wire cutting processing, and electrode processing. We pursue precision machining technology and do not forget to challenge ourselves to create new things, leading the manufacturing industry in Japan. Please feel free to contact us if you have any requests.

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